Samsung Electro-Mechanics Co., Ltd.

Yonsei University

Samsung Sds Co., Ltd.

Cellartgen Inc.

Se Won Park

Min Jung Kim

Seung Woo Cho

Ji Hoon Cho

Chang Joon Lee

Watanabe Ryoichi

No Seong Park

Yu Heun Kim

Su Kyeom Kim

Sung Jin Min

Chae Jeong Lee

Yeh Jin Shin

Soo Hwan An

Su Ran Kim

The present invention provides a printed circuit board including: a circuit pattern formed on a first insulating layer; a via pad disposed on the first insulating layer by being spaced apart from the circuit pattern, formed on a lower surface, where a via hole is formed, to have a cross section larger than that of the via hole, and having concavo-convex patterns; a second insulating layer formed on the via pad where the via hole is not formed and on the circuit pattern; and a copper foil layer formed on the second insulating layer and the via hole, and a method of manufacturing the same.

Printed circuit board including via pad with concavo-convex patterns and method of manufacturing the same

Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer.

Method of manufacturing a printed circuit board

Growing community of inventors

Seoul, South Korea

Se Won Park