Cheonan, South Korea

Se-Hyung Ryu


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Se-Hyung Ryu: Innovator in Array Printed Circuit Board Technology

Introduction

Se-Hyung Ryu is a notable inventor based in Cheonan, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit board technology. His innovative work has led to the creation of a patent that enhances the efficiency and functionality of circuit boards.

Latest Patents

Se-Hyung Ryu holds a patent for an "Array Printed Circuit Board." This invention includes at least one circuit board featuring a first surface. A first layout of first and second chip mounting regions is formed on the first half of the first surface, while a second layout of first and second chip mounting regions is formed on the second half. Notably, the first and second layouts exhibit opposite patterns for the chip mounting regions. This design improves the overall performance and versatility of circuit boards.

Career Highlights

Se-Hyung Ryu is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge projects that push the boundaries of electronic design and innovation. His expertise in printed circuit board technology has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Se-Hyung Ryu has collaborated with talented professionals in the field. Notable coworkers include Chang-Yong Park and Byung-Man Kim, who have contributed to various projects alongside him. These collaborations have fostered an environment of innovation and creativity.

Conclusion

Se-Hyung Ryu is a distinguished inventor whose work in array printed circuit board technology has made a significant impact in the electronics industry. His contributions continue to shape the future of electronic design and innovation.

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