The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Feb. 11, 2004
Applicants:
Chang-yong Park, Cheonan, KR;
Byung-man Kim, Cheonan0, KR;
Jong-soo Choi, Seoul, KR;
Kwang-ho Chun, Asan, KR;
Se-hyung Ryu, Cheonan, KR;
Inventors:
Chang-Yong Park, Cheonan, KR;
Byung-Man Kim, Cheonan0, KR;
Jong-Soo Choi, Seoul, KR;
Kwang-Ho Chun, Asan, KR;
Se-Hyung Ryu, Cheonan, KR;
Assignee:
Samsung Electronics Co., Ltd., Kyungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns.