This inventor holds 1 USPTO granted patent. Top assignees: Samsung Electronics Ltd., Semes Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 6,542 
1 out of 247 Years Active: 2026
Title: Se Hyun Lee: Inventor in Substrate Bonding Technology
Introduction
Se Hyun Lee is an inventor associated with Cheonan-si, South Korea. His patent work includes an apparatus designed to support and bond substrates using controlled deformation.
Latest Patents
Lee is credited with 1 patent, titled “Substrate Bonding Apparatus.” The invention describes a first chuck larger in diameter than the first substrate, a deformation plate that supports the substrate and can change shape on the chuck, and a deformation unit positioned between the chuck and plate. The deformation unit includes a deformable main supporter with a closed-curve shape and a penetrating center, configured to press the deformation plate.
Career Highlights
Lee’s listed company affiliations include Samsung Electronics and SEMES Co., Ltd. His patent reflects work on substrate-handling and bonding equipment.
Collaborations
Lee’s listed coworkers include Kyung Su Yoon and Ho Jin Kim.
Conclusion
Se Hyun Lee’s recorded invention focuses on a deformable support mechanism for substrate bonding, connecting his patent activity with his listed affiliations in the electronics and equipment industries.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile