The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Nov. 07, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
In Hwa Baek, Suwon-si, KR;
Se Hyun Lee, Cheonan-si, KR;
Su Chul Park, Cheonan-si, KR;
Kyung Su Yoon, Cheonan-si, KR;
Young Ho Kim, Suwon-si, KR;
Ho Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd, Suwon-si, KR;
SEMES CO., LTD., Cheonan-si, KR;
Abstract
A substrate bonding apparatus of the present disclosure includes a first chuck having a diameter larger than that of a first substrate; a deformation plate configured to support the first substrate, and is configured to have a variable shape on the first chuck; and a deformation unit between the first chuck and the deformation plate, wherein the deformation unit includes a main supporter that is deformable to press the deformation plate, the main supporter having a closed curve shape with a penetrating center.