Se-Chul Park

Title: Se-Chul Park: Innovator in Semiconductor Packaging

Introduction

Se-Chul Park is a notable inventor based in Changwon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of five patents. His innovative designs and methods have enhanced the performance and reliability of semiconductor devices.

Latest Patents

One of Se-Chul Park's latest patents is the Ag-pre-plated lead frame for semiconductor packages. This invention features a lead frame that includes a base metal layer made of copper, copper alloy, or iron-nickel alloy. It also incorporates an underlying plating layer of nickel or nickel alloy, an intermediate plating layer of palladium or palladium alloy, and an outer plating layer of silver or silver alloy. This design provides excellent oxidation and corrosion resistance, improving wire bondability and solderability while preventing heel cracks at wire bonding portions. Another significant patent is the lead frame and method of manufacturing the lead frame, which involves a series of steps to ensure minimal inclusions on the surface, thereby enhancing wire bonding properties and solder wettability.

Career Highlights

Se-Chul Park has worked with prominent companies in the aerospace and technology sectors, including Samsung Aerospace Industries and Samsung Techwin. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Se-Chul Park has collaborated with talented individuals such as Sung-il Kang and Kyu-han Lee. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Se-Chul Park's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the field positively, paving the way for future innovations.