The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2000
Filed:
Mar. 02, 1999
Applicant:
Inventors:
Se-chul Park, Changwon, KR;
Kyu-han Lee, Changwon, KR;
Ju-bong Kim, Changwon, KR;
Sung-il Kang, Changwon, KR;
Dong-il Shin, Changwon, KR;
Bae-soon Jang, Changwon, KR;
Assignee:
Samsung Aerospace Industries, Ltd., Kyongsangnam-Do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257677 ; 257769 ; 257762 ;
Abstract
A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.