Bae-soon Jang

Title: Bae-soon Jang: Innovator in Lead Frame Technology

Introduction

Bae-soon Jang is a notable inventor based in Changwon, South Korea. He has made significant contributions to the field of semiconductor packaging through his innovative patents. With a total of two patents to his name, Jang has focused on improving the manufacturing processes of lead frames.

Latest Patents

Jang's latest patents include a method for manufacturing a lead frame and a lead frame plating method. The first patent outlines a comprehensive process that involves electrocleaning, electropolishing, and rinsing a thin plate material, ultimately resulting in a lead frame with minimal inclusions. This innovation enhances the wire bonding properties and solder wettability of the lead frame. The second patent describes a lead frame plating method that includes forming an intermediate layer on a metal substrate and applying a modulated current to create a passive layer. This method ensures a high-quality finish on the lead frame.

Career Highlights

Throughout his career, Bae-soon Jang has worked with prominent companies such as Samsung Techwin Co., Ltd. and Samsung Aerospace Industries, Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in technology.

Collaborations

Jang has collaborated with notable coworkers, including Se-Chul Park and Dong-Il Shin. Their combined expertise has likely fostered an environment of innovation and creativity in their projects.

Conclusion

Bae-soon Jang's contributions to lead frame technology demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of manufacturing processes that enhance product quality.