Samsung Techwin Co., Ltd.

Samsung Aerospace Industries, Ltd.

Bae-soon Jang

Sung-il Kang

Se-Chul Park

Dong-Il Shin

Kyu-han Lee

Sang-hoon Lee

Ju-bong Kim

A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 &mgr;m, on the surface area of 1600 &mgr;m , which impede a wire bonding property or solder wettability of the lead frame.

Lead frame and method of manufacturing the lead frame

A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.

Lead frame for semiconductor package and lead frame plating method

Growing community of inventors

Changwon, South Korea

Bae-soon Jang