Changwon, South Korea

Ju-bong Kim

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Aerospace Industries, Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ju-bong Kim. Retrieved from https://idiyas.com/inventor/ju-bong-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ju-bong Kim

Introduction

Ju-bong Kim is a notable inventor based in Changwon, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor packaging.

Latest Patents

Ju-bong Kim holds a patent for a lead frame for semiconductor packages and a lead frame plating method. This patent includes a detailed process that involves forming an intermediate layer on the upper surface of a metal substrate, submerging the substrate into a plating solution, and forming a passive layer with a specific thickness by applying a modulated current. This innovative method improves the overall performance and reliability of semiconductor packages.

Career Highlights

Ju-bong Kim is currently employed at Samsung Aerospace Industries, Ltd., where he continues to push the boundaries of technology. His work at this prestigious company has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Se-Chul Park and Kyu-han Lee. Their combined expertise contributes to the advancement of semiconductor technologies within the company.

Conclusion

Ju-bong Kim's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Samsung Aerospace Industries, Ltd. continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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