This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Flir Systems, Incorporated. Active years: 2017-2020.
Company Filing History:
Years Active: 2017-2020
Title: Scott Vilander: Innovator in Wafer Level Packaging Technology
Introduction
Scott Vilander is a prominent inventor based in Santa Barbara, California. He has made significant contributions to the field of microbolometer vacuum package assemblies. With a total of 2 patents to his name, Vilander's work is recognized for its innovative approach to technology.
Latest Patents
One of Scott Vilander's latest patents focuses on the wafer level packaging of microbolometer vacuum package assemblies. This apparatus includes a wafer alignment and bonding chamber, a bolometer wafer chuck, and a lid wafer chuck, which are arranged in vertically facing opposition. The invention features means for creating an ultra-high vacuum environment within the chamber, as well as mechanisms for heating and cooling the wafer chucks independently. Additionally, it allows for vertical movement of the lid wafer chuck and translational movement of the bolometer wafer chuck in two orthogonal directions. The design also incorporates means for aligning fiducials on both the bolometer and lid wafers.
Career Highlights
Scott Vilander is currently employed at FLIR Systems, Incorporated, where he continues to develop cutting-edge technologies. His work has positioned him as a key player in the advancement of microbolometer technology.
Collaborations
Throughout his career, Vilander has collaborated with notable colleagues, including Paul Schweikert and Gregory A. Carlson. These partnerships have contributed to the success of his innovative projects.
Conclusion
Scott Vilander's contributions to wafer level packaging technology demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in microbolometer vacuum package assemblies.