Company Filing History:
Years Active: 2015-2019
Title: Scott Tice: A Pioneer in Wafer Processing Technologies
Introduction
Scott Tice is an innovative inventor based in Albany, OR, who has made significant contributions to the field of wafer processing. With a remarkable portfolio that includes six patents, Tice’s work focuses primarily on enhancing the efficiency and effectiveness of wafer drying and etching processes.
Latest Patents
Scott Tice’s latest patents showcase his deep understanding of wafer technology. The first patent, titled "Wafer Dryer Apparatus and Method," introduces a unique approach to Marangoni drying. In this invention, wafers are elevated from a first wafer carrier and a tank bath, ensuring effective drying while minimizing deposits that may occur during the process. The design incorporates a barrier to prevent these deposits from reaching the wafers and allows for static electricity to be discharged from the wafer supports in the offset position.
The second patent, "Metal Etch System," outlines innovative systems and methods for etching materials from wafers' surfaces. This technology includes a fluid reservoir for etchants and integrated mechanisms using a roller member that efficiently engages the wafers, letting them rotate in a controlled manner while in the fluid. This advanced design promotes improved etching processes, bolstering wafer fabrication efficiency.
Career Highlights
Throughout his career, Scott Tice has worked with notable companies, including Mei, Inc. and Mei Wet Processing Systems & Services LLC. His experience in these organizations has allowed him to push the boundaries of wafer processing, leading to several successful patent applications that reflect his expertise and commitment to innovation.
Collaborations
During his career, Tice has collaborated with industry professionals, including colleague Jeffrey M Wagner. Such partnerships have been instrumental in developing and refining technology that addresses contemporary challenges within the realm of wafer processing.
Conclusion
Scott Tice stands out as a significant figure in the realm of wafer processing innovations. His patents not only enhance fabrication techniques but also underscore his dedication to advancing technology in this field. As he continues to contribute his expertise, the impact of his work will likely resonate within the industry for years to come.