Company Filing History:
Years Active: 2000-2002
Title: Scott Butler: Innovator in Integrated Circuit Technology
Introduction
Scott Butler is a notable inventor based in Greenleaf, ID (US). He has made significant contributions to the field of integrated circuit technology, holding a total of 4 patents. His innovative work focuses on improving soldered connections in electronic devices.
Latest Patents
One of Scott's latest patents involves a method for soldering integrated circuit connections. This patent describes a process where solder paste is deposited using a solder stencil with an aperture that has a concave edge. This design aims to reduce the formation of solder balls, which can be detrimental to circuit performance. The solder deposit is formed on a pad, ensuring that the paste maintains a concave edge. Additionally, solder paste deposits can be made on adjacent pads with the concave surfaces facing one another, further enhancing the reliability of the connections.
Career Highlights
Scott Butler is currently employed at Micron Technology Incorporated, a leading company in semiconductor manufacturing. His work at Micron has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in technology.
Collaborations
Throughout his career, Scott has collaborated with talented individuals such as Richard Regner and Carey Blue. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Scott Butler's contributions to integrated circuit technology exemplify the spirit of innovation. His patents reflect a commitment to improving electronic device performance through thoughtful design and engineering.