This inventor holds 1 USPTO granted patent. Top assignee: Avago Technologies General IP Pte, Ltd.. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: The Innovations of Say Leong Tan
Say Leong Tan is a notable inventor based in Perak, Malaysia. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
One of Say Leong Tan's key patents is a semiconductor chip package with a package substrate and a lid cover. This invention includes a package substrate that features a first bond pad pattern. A semiconductor chip resides on this substrate, equipped with a second bond pad pattern. The lid cover houses the semiconductor chip and is fitted onto the package substrate. The second bond pattern of the semiconductor chip is connected to the first bond pattern of the package substrate through internal conductor traces of the lid cover. This innovative design improves the overall performance and reliability of semiconductor packages.
Career Highlights
Say Leong Tan is currently associated with Avago Technologies General IP Pte, Ltd. His role in the company has allowed him to further his research and development efforts in semiconductor technology. With a focus on innovation, he has been able to contribute to advancements that benefit the industry.
Conclusion
Say Leong Tan's work in semiconductor technology exemplifies the spirit of innovation. His patent for a semiconductor chip package showcases his ability to create solutions that address industry needs. His contributions continue to influence the field and inspire future advancements.