The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Dec. 16, 2002
Applicant:
Say Leong Tan, Perak, MY;
Inventor:
Say Leong Tan, Perak, MY;
Assignee:
Avago Technologies General IP Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip package includes a package substrate having a first bond pad pattern. A semiconductor chip resides on the package substrate. The semiconductor chip has a second bond pad pattern. A lid cover houses the semiconductor chip and is fitted onto the package substrate. The second bond pattern of the semiconductor chip is connected to the first bond pattern of the package substrate through internal conductor traces of the lid cover.