Yokkaichi, Japan

Satoru Sugimoto

This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Chemical Corporation. Active years: 1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoru Sugimoto. Retrieved from https://idiyas.com/inventor/satoru-sugimoto-lvfvnf2s

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 1997

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1 patent (USPTO):Explore Patents

Title: Satoru Sugimoto and His Adhesive Resin Composition Patent.

Introduction

Satoru Sugimoto is an inventor associated with Yokkaichi, Japan, and Mitsubishi Chemical Corporation. His patent work includes an adhesive resin composition designed to provide strong adhesion across a wide temperature range while remaining suitable for several molding processes.

Latest Patents

Sugimoto is credited with 1 patent: “Adhesive Resin Composition.” The invention combines an ethylene polymer, or a modified version of one, with a tackifier and a block copolymer containing vinyl-aromatic and conjugated-diene polymer blocks, or a hydrogenated product of those blocks.

The composition is described as useful for adhesives that offer broad-temperature adhesion and processability through film, sheet, and blow molding. It can also be used in laminates involving materials such as polyolefins, styrenic resins, polyesters, acrylic resins, and polyamides.

Career Highlights

Sugimoto’s listed patent reflects work on adhesive materials intended to combine bonding performance with manufacturing versatility. His association with Mitsubishi Chemical Corporation connects this invention to the company’s materials and chemical technology activities.

Collaborations

Tatsuoki Saito and Masafumi Hattori are identified as Sugimoto’s coworkers.

Conclusion

Satoru Sugimoto’s patent describes a versatile adhesive resin composition intended to support reliable bonding across varied temperatures, processing methods, and laminate materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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