The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Jan. 10, 1995
Masafumi Hattori, Yokkaichi, JP;
Chikako Ikeda, Yokkaichi, JP;
Satoru Sugimoto, Yokkaichi, JP;
Tatsuoki Saito, Yokkaichi, JP;
Hitoshi Yamada, Yokkaichi, JP;
Etsushi Akashige, Yokkaichi, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides.