Kanagawa, Japan

Satoru Honda

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Kabushiki Kaisha Toshiba. Active years: 2005-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Satoru Honda. Retrieved from https://idiyas.com/inventor/satoru-honda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2005-2014

Loading Chart...
6 patents (USPTO):Explore Patents

Title: Satoru Honda: Inventor of Electronic Apparatus Technologies.

Introduction

Satoru Honda is an inventor associated with Kanagawa, Japan, and Kabushiki Kaisha Toshiba. His patent work includes electronic apparatus designs that connect conductive patterns across molded housing components. The provided information lists 6 patents.

Latest Patents

Honda’s latest listed patents describe two approaches to connecting conductive patterns in an electronic apparatus.

One design uses a housing formed from first and second molded bodies. A conductive member passes through a gap at the bodies’ mating face, connecting a conductive pattern inside the housing to another pattern on its outer surface.

The other design also uses a housing made from two molded bodies. In this approach, a conductive pin passes through the first molded body to connect a pattern on its outer surface with a second pattern inside the housing.

Career Highlights

Honda’s listed inventions focus on electrical connections between internal and external conductive patterns in molded electronic-device housings. Both designs address how conductive elements pass through or across housing components.

Collaborations

Honda’s listed coworkers include Koichi Sato and Akihiro Tsujimura. The provided information associates his work with Kabushiki Kaisha Toshiba.

Conclusion

Satoru Honda’s listed patent portfolio highlights practical approaches to routing electrical connections through molded housings for electronic apparatus.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…