The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Sep. 21, 2007
Tomoko Honda, Kanagawa-ken, JP;
Nobuyoshi Kuroiwa, Kanagawa-ken, JP;
Masaomi Nakahata, Kanagawa-ken, JP;
Jun Morimoto, Kanagawa-ken, JP;
Satoru Honda, Kanagawa-ken, JP;
Yoshikazu Hata, Kanagawa-ken, JP;
Koichi Sato, Tokyo, JP;
Akihiro Tsujimura, Tokyo, JP;
Makoto Tabata, Tokyo, JP;
Minoru Sakurai, Tokyo, JP;
Shoji Kato, Tokyo, JP;
Tomoko Honda, Kanagawa-ken, JP;
Nobuyoshi Kuroiwa, Kanagawa-ken, JP;
Masaomi Nakahata, Kanagawa-ken, JP;
Jun Morimoto, Kanagawa-ken, JP;
Satoru Honda, Kanagawa-ken, JP;
Yoshikazu Hata, Kanagawa-ken, JP;
Koichi Sato, Tokyo, JP;
Akihiro Tsujimura, Tokyo, JP;
Makoto Tabata, Tokyo, JP;
Minoru Sakurai, Tokyo, JP;
Shoji Kato, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An electronic apparatus includes: a housing provided with a first conductive pattern; a substrate provided with a first wiring layer in a surface thereof and fixed to the housing; and a first conductive member connecting the first conductive pattern and the first wiring layer. The first conductive pattern extends onto an outer surface and an inner surface of the housing. The first conductive member is in contact with each of at least a part of the first conductive pattern extending onto the inner surface and an end of the first wiring layer. Alternatively, an electronic apparatus includes: a housing provided with a conductive pattern and having a through part in a frame portion thereof; and a substrate provided with a wiring layer on a surface thereof and having a protruding part and fixed to the housing. The protruding part and the through part are fit. The conductive pattern extends onto an outer surface of the housing and onto an inner surface of the through part. At least some of the conductive pattern extending onto the inner surface is in contact with an end of the wiring layer.