Company Filing History:
Years Active: 2003-2005
Title: Innovations of Sarangapani Sista
Introduction
Sarangapani Sista is a notable inventor based in Hillsboro, OR (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and performance of semiconductor devices.
Latest Patents
One of his latest patents is titled "Apparatus and method for adiabatically heating a semiconductor surface." This invention describes a method for adiabatically heating semiconductor device surfaces, utilizing capping layers to prevent deformation. The method allows for the heating of semiconductor surfaces with varying topographies or topologies. Another significant patent is "Thermally coupling electrically decoupling cooling device for integrated circuits." This cooling device is designed to be thermally disposed between a self-heating electrically conductive line and a semiconductor substrate. It effectively cools the line by transferring heat while blocking current flow into the substrate.
Career Highlights
Sarangapani Sista is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that enhance the performance of electronic devices.
Collaborations
Throughout his career, Sarangapani has collaborated with notable colleagues, including Timothy L Deeter and Thomas N Marieb. These collaborations have further enriched his work and contributed to the advancement of semiconductor technologies.
Conclusion
Sarangapani Sista's innovative patents and contributions to the semiconductor industry highlight his expertise and commitment to advancing technology. His work continues to influence the development of efficient semiconductor devices.