The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2005
Filed:
Sep. 24, 2002
Applicants:
Jose A. Maiz, Portland, OR (US);
Sarangapani Sista, Hillsboro, OR (US);
Mark Liu, Portland, OR (US);
Inventors:
Jose A. Maiz, Portland, OR (US);
Sarangapani Sista, Hillsboro, OR (US);
Mark Liu, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
G01B009/02 ;
U.S. Cl.
CPC ...
Abstract
A method for adiabatically heating semiconductor device surfaces, including using capping layers to prevent deformation of surfaces. Using the method, semiconductor surfaces having varying topographies or topologies may be heated adiabatically. In an embodiment of the method, one or more capping layers may be formed over a semiconductor surface, to further prevent deformation of semiconductor surfaces.