Ann Arbor, MI, United States of America

Santy Sulaiman

This inventor holds 2 USPTO granted patents. Top assignees: Delphi Technologies, Inc., University of Michigan. Active years: 2008-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Santy Sulaiman. Retrieved from https://idiyas.com/inventor/santy-sulaiman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 13(Granted Patents)


Location History:

  • Ypsilanti, MI (US) (2008)
  • Ann Arbor, MI (US) (2011)

Company Filing History:


Years Active: 2008-2011

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2 patents (USPTO):Explore Patents

Title: **The Innovative Concepts of Santy Sulaiman**

Introduction

Santy Sulaiman, an inventive mind based in Ann Arbor, MI, has made significant contributions to the field of materials science through his innovative patents. With two registered patents to his name, Sulaiman focuses on enhancing the properties and applications of silsesquioxanes and improving adhesive materials in electronics.

Latest Patents

Sulaiman's most recent patents showcase his expertise in reactant behavior and material engineering. One patent titled "Properties tailoring in silsesquioxanes - Fluoride catalyzed rearrangement reactions of polymeric silsesquioxanes" involves the reaction of silsesquioxane materials with a catalytic amount of organic fluoride at temperatures ranging from about -50°C to 120°C. This meticulous process allows for the formation of a reaction mixture over a period ranging from 60 minutes to 48 hours. A quenching agent is then introduced to eliminate fluoride from the mixture, resulting in an isolated silsesquioxane cage compound through precipitation or extraction methods.

Another recent patent is focused on "Flip chip system with organic/inorganic hybrid underfill composition." This invention presents a system for underfilling in chip packages that effectively addresses the coefficient of thermal expansion (CTE) mismatch between a packaged die and resin-impregnated fiberglass substrates. It features an underfill mixture, primarily containing a rigid octaaminophenyl silsesquioxane (OAPS) that acts as a curing agent for a low-viscosity TGMX epoxy resin, which ultimately enhances the performance and durability of flip chip packages.

Career Highlights

Sulaiman has built a solid career foundation by working with reputable organizations. He has been associated with Delphi Technologies, Inc., and the University of Michigan, where he expanded his research and practical knowledge in materials design and engineering. His professional journey reflects his commitment to advancing technology and improving existing applications in various domains.

Collaborations

Across his career, Sulaiman has collaborated with distinguished colleagues, including Richard M. Laine and Rafil A. Basheer. These partnerships have not only enriched his research but have also contributed to the development of innovative solutions within their respective fields.

Conclusion

In conclusion, Santy Sulaiman exemplifies the spirit of innovation through his patents and collaborative efforts. His work in developing advanced materials like silsesquioxanes demonstrates the potential for transforming industries, particularly in electronics and materials science. As an inventor, Sulaiman continues to inspire future generations of researchers and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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