The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Oct. 04, 2005
Rafil Basheer, Rochester Hills, MI (US);
Richard M. Laine, Ann Arbor, MI (US);
Santy Sulaiman, Ypsilanti, MI (US);
Chad M. Brick, Ann Arbor, MI (US);
Christopher M. Desana, Ann Arbor, MI (US);
Rafil Basheer, Rochester Hills, MI (US);
Richard M. Laine, Ann Arbor, MI (US);
Santy Sulaiman, Ypsilanti, MI (US);
Chad M. Brick, Ann Arbor, MI (US);
Christopher M. Desana, Ann Arbor, MI (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.