Ann Arbor, MI, United States of America

Chad M Brick


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovator Chad M. Brick: Advancements in Flip Chip Technology

Introduction: Chad M. Brick, an accomplished inventor based in Ann Arbor, MI, has made significant contributions to the field of semiconductor packaging. With one patented innovation to his name, he exemplifies the spirit of creativity and problem-solving that drives the tech industry forward.

Latest Patents: Chad's notable patent, titled "Flip Chip System with Organic/Inorganic Hybrid Underfill Composition," addresses a critical issue in chip packaging. This system for underfilling features an innovative underfill mixture that mitigates the coefficient of thermal expansion (CTE) mismatch commonly found between packaged dies and resin-impregnated fiberglass mounting substrates. In his patent, he employs a principal underfill composition based on a rigid octaaminophenyl silsesquioxane (OAPS), which serves as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. Furthermore, his invention encompasses the assembly of a flip chip package utilizing this advanced underfill mixture.

Career Highlights: Chad is currently associated with Delphi Technologies, Inc., where he continues to work at the forefront of chip packaging innovations. His expertise in materials science and semiconductor technology has been instrumental in the development of solutions that enhance both the reliability and efficiency of electronic devices.

Collaborations: Throughout his career, Chad has collaborated with distinguished colleagues such as Rafil A. Basheer and Richard M. Laine. Together, they have fostered a creative environment that encourages innovation and the pursuit of cutting-edge technologies in the semiconductor industry.

Conclusion: In summary, Chad M. Brick's contributions to the field of flip chip technology demonstrate his commitment to advancing semiconductor packaging solutions. His patented innovations not only address significant challenges in the industry but also reflect the collaborative efforts of his talented coworkers. As he continues to push the boundaries of what is possible, the impact of his work will undoubtedly be felt in the evolving landscape of technology.

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