Christopher M Desana

Title: Inventor Spotlight: Christopher M. Desana

Introduction

Christopher M. Desana, based in Ann Arbor, Michigan, is a talented inventor recognized for his contributions to the field of technology with a focus on electronic components. He holds a patent that reflects his innovative approach to addressing challenges in chip packaging.

Latest Patents

Desana's notable patent is titled "Flip chip system with organic/inorganic hybrid underfill composition." This invention introduces a sophisticated system for underfilling in chip packages, designed to address the coefficient of thermal expansion (CTE) mismatch between a packaged die and a resin-impregnated fiberglass mounting substrate. The underfill mixture incorporates a rigid octaaminophenyl silsesquioxane (OAPS) as a curing agent for a tetrafunctional, low-viscosity, and relatively rigid TGMX epoxy resin. His invention is pivotal in enhancing the reliability and durability of flip chip packages.

Career Highlights

Christopher M. Desana is currently employed at Delphi Technologies, Inc., where he continues to push the boundaries of technology through his innovative endeavors. His expertise and creativity have not only led to the development of his patent but have also made significant contributions to the projects within his organization.

Collaborations

Throughout his career, Desana has collaborated with accomplished colleagues, including Rafil A. Basheer and Richard M. Laine. These partnerships have fostered an environment of shared knowledge and innovative spirit, enhancing the overall impact of their collective work.

Conclusion

Christopher M. Desana exemplifies the spirit of innovation in the technology sector. His patent for the flip chip system highlights his ability to solve complex engineering problems. As he continues his work at Delphi Technologies, Inc., the industry eagerly anticipates further advancements that will emerge from his expertise and creative vision.