This inventor holds 1 USPTO granted patent. Top assignee: Fairchild Semiconductor Corporation. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: **Innovative Packaging Solutions: The Contributions of Santos E. Mepieza**
Introduction
Santos E. Mepieza, an inventive mind located in Mandaue, Philippines, has made significant strides in the field of packaging technology. With a focus on efficiency and innovation, Mepieza has contributed to the advancement of semiconductor packaging through his unique methods and designs.
Latest Patents
Mepieza holds a patent for a groundbreaking method of packaging a plurality of chip devices. The patented method, titled "Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails," outlines a sophisticated arrangement for effectively packaging chip devices. This method involves the use of bottom and top leadframes that are coupled by rails to create an assembly. The process includes placing dies between these leadframe assemblies, attaching them to the die attach pads of the bottom leadframes, and connecting them to the top leadframes with solder bumps. A molded body encases the assembly, after which the rails are removed, resulting in the successful packaging of multiple chip devices.
Career Highlights
Santos E. Mepieza has demonstrated his expertise while working at Fairchild Semiconductor Corporation. His role there emphasizes his commitment to innovative practices in electronics and semiconductor technology. Mepieza's inventive approach has not only led to his patent but has also had a lasting impact on the industry.
Collaborations
Throughout his career, Mepieza has had the opportunity to work alongside skilled colleagues such as Maria Clemens Y Quinones and Gilmore S. Baje. Their collaborative efforts exemplify the synergy that can result from teamwork in engineering and innovation.
Conclusion
Santos E. Mepieza stands out as a prominent inventor in the field of semiconductor packaging. His innovative methods and collaborative spirit continue to contribute to advancements that shape the future of technology and efficiency in packaging solutions. With his patented work paving the way for further developments, Mepieza represents the essence of innovation within the semiconductor industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile