Sangsu Ha

Title: The Innovative Contributions of Sangsu Ha

Introduction: Sangsu Ha, an accomplished inventor based in Suwon-si, South Korea, has made significant strides in the field of semiconductor technology. With a total of five patents to his name, his work primarily focuses on enhancing the efficiency and efficacy of semiconductor packages.

Latest Patents: Among Sangsu Ha's latest innovations is a patent for a package substrate and semiconductor package, which introduces an insulation substrate that includes upper and lower pads connected to a conductive layer. This design features a trench that effectively blocks stress generated by the expansion of the insulation substrate from affecting the upper pads. Another notable patent relates to an interconnect structure and semiconductor chip, which details a complex assembly that incorporates a back end of line (BEOL) structure and a conductive reinforcing layer. These inventions showcase his expertise in advancing semiconductor technology through innovative solutions.

Career Highlights: Currently, Sangsu Ha is associated with Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor design. His deep knowledge and commitment to developing new methodologies have helped the company maintain its position as a leader in technology.

Collaborations: Throughout his career, Sangsu Ha has collaborated with talented colleagues like Byungwook Kim and Ayoung Kim. Together, they have contributed to advancing the field through innovative research and development, paving the way for future breakthroughs in semiconductor technology.

Conclusion: Sangsu Ha stands out as an impactful inventor in the semiconductor industry, with a portfolio that exemplifies the fusion of creativity and technical prowess. His ongoing work and collaborations at Samsung Electronics Co., Ltd. not only contribute to the company's success but also shape the future of semiconductor technology.