Samsung Electronics Co., Ltd.

Sangsu Ha

Byungwook Kim

Ayoung Kim

Seongwon Jeong

Taehoon Kim

Seonghun Kim

Soojae Park

Jungsoo Kim

Seungbae Lee

Hyunsuk Chun

Haeseong Jeong

Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.

Package substrate and semiconductor package including the same

A semiconductor chip includes a back end of line (BEOL) structure on a first surface of the semiconductor substrate and including a conductive connection structure and an interlayer insulating layer covering the conductive connection structure, a conductive reinforcing layer arranged on the BEOL structure, a cover insulating layer covering the conductive reinforcing layer, an under bump metal (UBM) layer including a plurality of pad connection portions connected to the conductive reinforcing layer through openings in the cover insulating layer, and a plurality of first connection bumps arranged on the plurality of pad connection portions of the UBM layer, electrically connected to one another through the conductive reinforcing layer, and located to overlap the conductive reinforcing layer. The conductive reinforcing layer has a plate shape and extends parallel to the first surface of the semiconductor substrate.

Interconnect structure and semiconductor chip including the same

Various embodiments of the present invention relate to a method for compensating for a pressure value of a force sensor and an electronic device using the same, the electronic device comprising: a touch screen display; a force sensor bonded to a lower portion of the touch screen display; a memory; and a processor electrically connected to the touch screen display, the force sensor, and the memory, wherein the processor is configured to: obtain a pressure value of the touch screen display and a pressure value of the force sensor; measure the correlation between the obtained pressure value of the touch screen display and the pressure value of the force sensor; identify a spacing state between the touch screen display and the force sensor by using the correlation; determine whether the spacing state is of a predetermined distance or less and compensate for the pressure value for determining whether to operate the force sensor by using a predetermined reference value when the spacing state is of the predetermined distance or less, thereby sensing the spacing state in real time when spacing occurs between the touch screen display and the force sensor of the electronic device, and compensating for the pressure value of the force sensor such that user convenience can be improved. In addition to the embodiments disclosed in the present invention, other various embodiments are possible.

Method for compensating for pressure value of force sensor and electronic device using same

Provided is a semiconductor package including a wiring substrate having top and bottom surfaces. A first semiconductor chip is disposed on the wiring substrate in a flip-chip manner. The first semiconductor chip has a first surface facing the top surface of the wiring substrate and a second surface opposite to the first surface. First connection members are disposed between the wiring substrate and the first semiconductor chip. The first connection members include first and second contact members each including one or more magnetic materials. The first contact members include portions disposed in the second contact members. The one or more magnetic material of the first contact members have an opposite polar orientation to that of the second contact members.

Semiconductor package having magnetic connection member

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Suwon-si, South Korea

Sangsu Ha