Cheonan-si, South Korea

Sangmin Yong


Average Co-Inventor Count = 4.4

ph-index = 1


Location History:

  • Cheonan-si, KR (2023)
  • Seongnam-si, KR (2024)
  • Chungcheongnam-do, KR (2024)

Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):Explore Patents

Title: Innovator Sangmin Yong – A Pioneer in Semiconductor Packaging

Introduction

Sangmin Yong is a prominent inventor based in Cheonan-si, South Korea, recognized for his contributions to the field of semiconductor packaging. With a total of three patents to his name, Yong has carved a niche for himself within the technology sector, especially while working at one of the leading companies in electronics.

Latest Patents

Yong's latest patents showcase his innovative approach to semiconductor packaging. His first notable patent describes a semiconductor package that incorporates an interposer, facilitating enhanced connectivity between various elements. This package includes a package substrate and a unique interposer featuring a semiconductor substrate and wiring layers with multiple wirings. The structure allows for efficient electrical connections among the first and second semiconductor devices placed on the interposer.

His second patent presents a semiconductor package with a memory stack structure connected to logic dies via an interposer. This inventive design includes a package substrate with a memory stack that vertically overlaps the interposer substrate, effectively optimizing space and improving performance by ensuring efficient electrical interconnections.

Career Highlights

Sangmin Yong's career is accentuated by his role at Samsung Electronics Co., Ltd., a leading name in the technology industry. This position not only reflects his expertise but also places him at the forefront of semiconductor innovation. His work contributes significantly to advancements in device efficiency and miniaturization, essential elements in modern electronics.

Collaborations

Collaboration is key to innovation, and Yong works alongside talented individuals like Jinhyun Kang and Seungkwan Ryu. Together, they tackle complex challenges in semiconductor design and implementation, pooling their diverse skills and knowledge to push the boundaries of technology further.

Conclusion

With three patents under his belt and a robust career at Samsung Electronics, Sangmin Yong exemplifies the spirit of innovation in semiconductor packaging. His contributions not only enhance the functionality of electronic devices but also pave the way for future advancements in the industry. His ongoing work promises to inspire new generations of engineers and inventors in the field of semiconductor technology.

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