The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Feb. 17, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Yanggyoo Jung, Gwangmyeong-si, KR;
Seungbin Baek, Suwon-si, KR;
Hyunjung Song, Hwaseong-si, KR;
Sangmin Yong, Seongnam-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided is a semiconductor package including a first wiring pad on a package substrate; a first wiring connection part on the first wiring pad and including a wiring solder layer; a second wiring pad on the package substrate; a second wiring connection part on the second wiring pad and including a conductor; an interposer substrate on the first wiring connection part and the second wiring connection part, wherein a first substrate connection part and a second substrate connection part respectively electrically connected to the first wiring connection part and the second wiring connection part are arranged on a rear surface of the interposer substrate; and semiconductor chips apart from each other in a two-dimensional manner on the interposer substrate, wherein each of the semiconductor chips is electrically connected to the interposer substrate via a chip connection pillar.