SangJin Lee

Title: Innovations of SangJin Lee in Integrated Circuit Packaging

Introduction

SangJin Lee is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on innovative methods of manufacturing integrated circuit packaging systems, which are crucial for the advancement of electronic devices.

Latest Patents

SangJin Lee's latest patents include an "Integrated circuit packaging system with fan-in package and method of manufacture thereof." This patent describes a method that involves providing a base substrate, connecting a base component directly to the substrate, and mounting a stack component over the base component. Additionally, it details the process of attaching a flattened exposed interconnect directly on the stack component and applying an encapsulant over the stack component, ensuring a portion of the interconnect remains exposed.

Another significant patent is the "Method of manufacturing integrated circuit packaging system with support structure." This invention outlines a method that includes providing a substrate, forming a connection post on the substrate, and mounting an integrated circuit die on the substrate. The process also involves molding an encapsulation on the integrated circuit die and the connection post, followed by forming a connector recess in the encapsulation by removing the encapsulation around the connection post.

Career Highlights

SangJin Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of integrated circuit packaging. His expertise and contributions have positioned him as a key figure in his company and the industry.

Collaborations

He has collaborated with notable coworkers, including In Sang Yoon and SeongMin Lee, who share his commitment to advancing technology in integrated circuit packaging.

Conclusion

SangJin Lee's innovative work in integrated circuit packaging has led to significant advancements in the field. His patents reflect a deep understanding of manufacturing processes that enhance the functionality and efficiency of electronic devices.