This inventor holds 1 USPTO granted patent and 7 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Sanghoo Cho - Innovator in Semiconductor Technology
Introduction
Sanghoo Cho is an inventor based in Suwon-si, South Korea. He is known for his contributions to semiconductor technology, focusing on innovative packaging solutions. Although he currently holds no granted patents, his work in the field is noteworthy.
Latest Patent Applications
Sanghoo Cho has filed several patent applications that showcase his expertise in semiconductor devices. One of his latest applications is titled "DEVICE FOR SEMICONDUCTOR PACKAGE COMPRISING CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME." This application describes a semiconductor device that includes a structure with a dielectric layer and a wire pattern embedded within it. The dielectric layer consists of first regions and a second region surrounding them, with the second region's upper surface positioned lower than that of the first regions. A barrier layer is placed on the structure, connecting to the wire pattern, followed by a seed metal layer and a conductive pad.
Another significant application is for a "SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME." This application details semiconductor packages and their fabrication methods. The semiconductor package includes a substrate, a seed layer, and a wiring pad. The wiring pad features a pad portion and a capping layer that covers both the top and lateral surfaces of the pad portion. Notably, the width of the top surface of the pad portion is greater than that of the bottom surface.
Conclusion
Sanghoo Cho is an innovative inventor in the semiconductor field, with a focus on advanced packaging techniques. His latest patent applications reflect his commitment to enhancing semiconductor technology.