The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
May. 01, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Dongjoon Oh, Suwon-si, KR;
Jumyong Park, Suwon-si, KR;
Solji Song, Suwon-si, KR;
Hyunchul Jung, Suwon-si, KR;
Sanghoo Cho, Suwon-si, KR;
Hyunsu Hwang, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a semiconductor package including forming a first semiconductor chip including a first substrate having a first and second surfaces and forming a second semiconductor chip including a second substrate having third and fourth surfaces. Arranging the second semiconductor chip on the first semiconductor chip such that bonding pads that are exposed from the front surface of the second semiconductor chip are bonded to conductive pads that are exposed from the rear surface of the first semiconductor chip. Forming a first through via having a first diameter and that penetrates the first substrate. Forming an insulating layer that exposes a first end of the first through via on the second surface of the first substrate, etching the first end of the first through via to a first depth, and applying a conductive material to the first end to form the conductive pad having a second diameter.