SangDuk Lee

Title: The Innovations of SangDuk Lee

Introduction

SangDuk Lee is a notable inventor based in Dublin, California. He has made significant contributions to the field of semiconductor devices, holding a total of 3 patents. His work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

One of SangDuk Lee's latest patents is for a molded laser package with an electromagnetic interference shield and method of making. This innovative semiconductor device features a substrate that includes a carrier and an interposer. An electrical component is positioned over the first surface of the interposer, while an interconnect structure is also placed on this surface. An encapsulant is then deposited over the electrical component, interconnect structure, and substrate. A trench is formed through the encapsulant and interposer into the carrier, allowing for a shielding layer to be created over the encapsulant and into the trench. The carrier is subsequently removed after the shielding layer is formed, showcasing a novel approach to semiconductor design.

Career Highlights

SangDuk Lee is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor industry. His expertise and dedication have positioned him as a key player in his field.

Collaborations

SangDuk Lee has collaborated with talented individuals such as HunTeak Lee and HeeSoo Lee. These partnerships have contributed to the advancement of their projects and the overall success of their innovations.

Conclusion

SangDuk Lee's contributions to semiconductor technology through his patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future innovations.