Sang Su Ha

Title: The Innovations of Sang Su Ha

Introduction

Sang Su Ha is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a semiconductor package and manufacturing method designed to reduce or prevent cracks from occurring in a conductive bump. This semiconductor package includes a semiconductor chip, a first conductive bump, a first re-distribution layer that electrically connects the semiconductor chip and the first conductive bump, and a buffer structure with a plurality of pores. Another significant patent is for a semiconductor device that features a semiconductor chip with a gate structure. This device includes first solder balls containing a specific weight percent of silver, second solder balls with a greater weight percent of silver, and third solder balls with a lesser weight percent of silver, all strategically placed on the semiconductor chip.

Career Highlights

Sang Su Ha is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of semiconductor innovation, contributing to advancements that have a wide-ranging impact on technology.

Collaborations

He has collaborated with talented coworkers such as Sung Young Yoon and Yong Sang Cho, further enhancing the innovative environment at Samsung Electronics.

Conclusion

Sang Su Ha's contributions to semiconductor technology through his patents and work at Samsung Electronics highlight his role as a key innovator in the field. His inventions not only address current challenges but also pave the way for future advancements in semiconductor technology.