The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2020

Filed:

Sep. 10, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung Young Yoon, Gongju-si, KR;

Yong Sang Cho, Hwaseong-si, KR;

Sang Su Ha, Suwon-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/53295 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 27/0688 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14505 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip including a gate structure, the semiconductor chip having a first region and a second region that surrounds sides of the first region, first solder balls on the first region of the semiconductor chip and containing a first weight percent of silver, second solder balls on the first region of the semiconductor chip and containing a second weight percent of silver greater than the first weight percent, and third solder balls on the second region of the semiconductor chip and containing a third weight percent of silver less than the first weight percent.


Find Patent Forward Citations

Yoon, Sung. (2020). Semiconductor device (U.S. Patent No. 10643935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10643935

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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