Kyounggi-Do, China

Sang Phil Lee

This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sang Phil Lee. Retrieved from https://idiyas.com/inventor/sang-phil-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Sang Phil Lee

Introduction

Sang Phil Lee is a notable inventor based in Kyounggi-Do, CN. He has made significant contributions to the field of semiconductor technology, particularly in the area of chamber cleaning processes.

Latest Patents

One of his key patents is titled "In-situ chamber cleaning for an RTP chamber." This invention presents a method for cleaning a chamber used for annealing doped wafer substrates. The method involves removing dopants deposited in an annealing chamber after the annealing process by flowing one or more volatilizing gases into the chamber. Heat is then applied to volatilize the deposited dopants, followed by exhausting the chamber to remove the volatilized dopants.

Career Highlights

Sang Phil Lee is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His work focuses on enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

He has collaborated with notable colleagues, including Balasubramanian Ramachandran and Tae Jung Kim, to further advance innovations in their field.

Conclusion

Sang Phil Lee's contributions to semiconductor technology, particularly through his innovative patent, demonstrate his commitment to improving manufacturing processes. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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