Sang-nam Jeong

Title: The Innovations of Sang-nam Jeong

Introduction

Sang-nam Jeong is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of Sang-nam Jeong's latest patents involves a semiconductor package. This innovative package includes a base substrate with bonding pads and connection pads on its upper and lower surfaces. It features four semiconductor chips, namely a 1A chip, a 1B chip, a 2A chip, and a 2B chip. Each chip has a plurality of chip pads adjacent to the first edge of its upper surface. A bonding wire electrically connects the chip pads to the bonding pads. The design ensures that the first edges of the four semiconductor chips face different edges of the package base substrate.

Career Highlights

Sang-nam Jeong is currently employed at Samsung Electronics Co., Ltd. His work at this leading technology company has allowed him to develop and refine his innovative ideas in semiconductor packaging. His contributions have been instrumental in advancing the capabilities of semiconductor technology.

Collaborations

Sang-nam Jeong has collaborated with notable coworkers, including Seok-hong Kwon and Sun-Won Kang. Their teamwork has fostered an environment of innovation and creativity within their projects.

Conclusion

Sang-nam Jeong's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a significant inventor in the field. His innovative designs continue to shape the future of semiconductor packaging.