Samsung Electronics Co., Ltd.

Sang-nam Jeong

Sun-Won Kang

Hee-jin Lee

Seok-hong Kwon

A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of the package base substrate, four semiconductor chips attached onto the package base substrate, including a 1A semiconductor chip, a 1B semiconductor chip, a 2A semiconductor chip, and a 2B semiconductor chip, and each including a plurality of chip pads that are adjacent to a first edge of an upper surface of each of the 1A semiconductor chip, the 1B semiconductor chip, the 2A semiconductor chip, and the 2B semiconductor chip, and a bonding wire electrically connecting the chip pad and the bonding pad to each other, wherein the four semiconductor chips are disposed on the package base substrate such that first edges of the four semiconductor chips respectively face edges of the package base substrate that are different from each other.

Growing community of inventors

Hwaseong-si, South Korea

Sang-nam Jeong