Sang Hyun Ryu

Title: Innovations by Sang Hyun Ryu in Semiconductor Technology

Introduction

Sang Hyun Ryu is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on improving semiconductor packaging methods and manufacturing processes.

Latest Patents

One of his latest patents is titled "Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant." This invention discloses a lead frame designed for semiconductor packages, featuring lead locks that enhance the bonding force of inner leads to the resin encapsulate. This innovation effectively prevents the separation of inner leads during the singulation process in semiconductor fabrication. Another notable patent is the "Method for manufacturing a semiconductor device substrate," which outlines a process for creating a substrate without bus lines and lead-in lines. This method involves temporarily attaching a conductive film to circuit patterns, allowing for efficient electroplating and ensuring that the resulting substrate maintains electrical independence among its circuit patterns.

Career Highlights

Sang Hyun Ryu is currently employed at Amkor Technology, Inc., a leading company in semiconductor packaging and testing services. His expertise in semiconductor technology has positioned him as a valuable asset to the company, contributing to advancements in packaging solutions.

Collaborations

Throughout his career, Ryu has collaborated with notable colleagues, including Jae Hak Yee and Young Suk Chung. These partnerships have fostered innovation and development in semiconductor technologies.

Conclusion

Sang Hyun Ryu's contributions to semiconductor technology through his patents and work at Amkor Technology, Inc. highlight his role as a key innovator in the field. His inventions continue to influence the efficiency and effectiveness of semiconductor manufacturing processes.