Plymouth, MN, United States of America

Sang-Huyn Oh


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Sang-Huyn Oh in Plasmonics and Metamaterials

Introduction

Sang-Huyn Oh is an accomplished inventor based in Plymouth, MN (US). He has made significant contributions to the field of plasmonics and metamaterials through his innovative work. His research focuses on the replication of patterned thin-film structures, which has important applications in various technological domains.

Latest Patents

Sang-Huyn Oh holds a patent for the "Replication of patterned thin-film structures for use in plasmonics and metamaterials." This invention provides templating methods for replicating patterned metal films from a template substrate, which can be utilized in plasmonic devices and metamaterials. The advantage of this invention lies in the reusability of the template substrate, allowing for multiple copies of the structure. The high-quality substrates available ensure that the patterned metal films replicate the surface characteristics of the template substrate effectively.

Career Highlights

Sang-Huyn Oh is affiliated with the University of Minnesota, where he continues to advance his research in the field. His work has garnered attention for its potential to enhance the performance of plasmonic devices, which are crucial in various applications, including sensors and imaging technologies.

Collaborations

Sang-Huyn Oh has collaborated with notable colleagues, including David J Norris and Sang Eon Han. These collaborations have contributed to the advancement of research in the field of plasmonics and metamaterials.

Conclusion

Sang-Huyn Oh's innovative contributions to the field of plasmonics and metamaterials highlight his role as a leading inventor. His patent on the replication of patterned thin-film structures showcases the potential for significant advancements in technology.

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