Sang Eon Oh

Title: Sang Eon Oh: Innovator in Semiconductor Packaging Technology

Introduction

Sang Eon Oh is a prominent inventor based in Seongnam, South Korea. He has made significant contributions to the field of semiconductor packaging technology. With a total of 3 patents to his name, his work has been instrumental in advancing the efficiency and effectiveness of electronic components.

Latest Patents

One of Sang Eon Oh's latest patents is the "Solder ball grid array carrier package with heat sink." This innovative design features a circuit board equipped with conductive wirings and multiple through holes. A semiconductor chip is mounted on the upper surface of the circuit board, with bonding wires connecting it to the conductive wirings. The design includes a plurality of solder balls that are electrically connected to the wirings and adhered to the lower surface of the circuit board. Additionally, a heat sink is attached to the lower surface, allowing for effective heat dissipation through the through holes.

Another notable patent is the "Printed circuit board having solder ball mounting groove pads and a ball." This invention involves a ball grid array package that includes a semiconductor chip and a circuit board with multiple conductive wiring pattern layers. The design incorporates electrically conductive wires that interconnect the semiconductor chip and the wiring, encapsulated by mold resin. A plurality of solder balls are adhered to the bottom surface of the circuit board, ensuring electrical interconnection via the pattern layers.

Career Highlights

Sang Eon Oh is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to focus on innovative solutions in semiconductor packaging, contributing to the company's reputation for cutting-edge technology.

Collaborations

Throughout his career, Sang Eon Oh has collaborated with notable colleagues, including Seung Kon Mok and Gu S Kim. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Sang Eon Oh's contributions to semiconductor packaging technology highlight his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving electronic component efficiency, making him a valuable asset in the industry.