The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1999
Filed:
Oct. 17, 1997
Sang Eon Oh, Seongnam, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A solder ball grid array carrier package has a circuit board with conductive wirings and a plurality of through holes. At least one semiconductor chip is mounted on an upper surface of the circuit board and bonding wires electrically connect the chip to the conductive wirings. A plurality of solder balls are electrically connected to the conductive wirings, with the solder balls being adhered to a lower surface of the circuit board. A heat sink is also adhered to the lower surface of the circuit board. The heat sink is in direct contact with the through holes of the circuit board, with the through holes allowing for heat dissipation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile