Sang Duck Kim

Title: Innovations of Sang Duck Kim

Introduction

Sang Duck Kim is a notable inventor based in Cheongju, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work primarily focuses on methods and materials that enhance the manufacturing processes of semiconductor packages.

Latest Patents

Sang Duck Kim's latest patents include a method of manufacturing a ball grid array substrate and a semiconductor chip package. The method involves forming circuit patterns on metal carriers, stacking insulating layers with separable materials, and ultimately creating a high-density circuit pattern. This innovative approach allows for the production of ultra-thin ball grid array substrates, which can be integrated into existing devices. The second patent details the structure of the ball grid array substrate, emphasizing its insulating layer and the buried circuit pattern, which enhances the efficiency and density of semiconductor chip packages.

Career Highlights

Sang Duck Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics and semiconductor industry. His work at Samsung has positioned him as a key player in advancing semiconductor manufacturing technologies. His patents reflect his commitment to innovation and excellence in this competitive field.

Collaborations

Throughout his career, Sang Duck Kim has collaborated with talented individuals such as Jung Hyun Park and Nam Keun Oh. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in semiconductor manufacturing.

Conclusion

Sang Duck Kim's contributions to the field of semiconductor technology are noteworthy. His innovative patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a leading inventor in the industry. His advancements continue to shape the future of semiconductor manufacturing.