This inventor holds 1 USPTO granted patent. Top assignee: Ecole Polytechnique Federale De Lausanne. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Sandro Carrara: Innovator in Silicon Wafer Technology
Introduction
Sandro Carrara is a notable inventor based in La Conversion, Switzerland. He has made significant contributions to the field of silicon wafer technology, particularly in the manufacturing of high aspect ratio through-silicon vias.
Latest Patents
Carrara holds a patent for a "System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers." This innovative method involves manufacturing vias in a silicon wafer with a <110> crystal orientation and a <111> plane that is perpendicular to the wafer's surface, tilted by 35.26°. The process includes providing a mask with a rhomboidal-shaped opening on the wafer's surface, aligning the edges with the <111> plane of the crystalline structure, etching a hole at the opening, and polishing the hole through anisotropic etching.
Career Highlights
Carrara is affiliated with the École Polytechnique Fédérale de Lausanne, where he continues to advance research in semiconductor technologies. His work has been instrumental in improving the efficiency and effectiveness of silicon wafer manufacturing processes.
Collaborations
He collaborates with esteemed colleagues such as Simone Frasca and Edoardo Charbon, contributing to a dynamic research environment that fosters innovation.
Conclusion
Sandro Carrara's contributions to silicon wafer technology exemplify the impact of innovative thinking in the field of semiconductor manufacturing. His patent and ongoing research efforts continue to shape the future of this critical technology.