Taipei, Taiwan

San-Feng Lin

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 64(Granted Patents)


Location History:

  • Sinjhuang, TW (2006 - 2009)
  • Taipei, TW (2007 - 2021)

Company Filing History:


Years Active: 2006-2021

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14 patents (USPTO):Explore Patents

Title: San-Feng Lin: Innovator in Clad Metal Casing Technology

Introduction

San-Feng Lin is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic device casing technology. With a total of 14 patents to his name, Lin has established himself as a key figure in innovation.

Latest Patents

Among his latest patents is a method of manufacturing a clad metal casing. This method involves arranging and connecting metallic materials of different types to form a clad board. The process includes shaping the clad board and post-processing the appearance surface to create a clad metal casing. The final product showcases surfaces of at least two metallic materials. Another notable patent is for a casing assembly and electronic device that features a connecting assembly comprising a metal casing and an injection-molded frame. This innovative design includes a first surface fixed to the metal casing and a second surface equipped with multiple connecting structures.

Career Highlights

San-Feng Lin is currently employed at Asustek Computer Inc., where he continues to develop cutting-edge technologies. His work has significantly impacted the design and functionality of electronic devices.

Collaborations

Lin collaborates with talented coworkers, including Yuan-An Hsu and Yi-Chuan Li, to drive innovation in their projects.

Conclusion

San-Feng Lin's contributions to clad metal casing technology and his ongoing work at Asustek Computer Inc. highlight his role as a leading inventor in the electronics industry. His innovative patents continue to shape the future of electronic device design.

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