Samuel Jiang

Title: Samuel Jiang - Innovator in Photonic-Electronic Chip Packaging

Introduction

Samuel Jiang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of photonic-electronic chip technology. His innovative approach to packaging methods has garnered attention in the industry.

Latest Patents

Samuel Jiang holds a patent for a three-dimensional packaging method and package structure of a photonic-electronic chip. The patent outlines a method that includes fixing an electronic chip on a first area of a first surface of a photonic chip. Additionally, it describes the process of fixing a dummy chip on a second area of the first surface of the photonic chip. The photonic chip is equipped with an optical coupling interface at the second area, while the dummy chip features a cavity with a single-sided opening that faces and covers the optical coupling interface. This innovative packaging method enhances the functionality and efficiency of photonic-electronic chips.

Career Highlights

Samuel Jiang is currently employed at Hangzhou Guangzhiyuan Technology Co., Ltd. His work at this company focuses on advancing technologies related to photonic-electronic integration. With a patent portfolio that includes 1 patent, he continues to push the boundaries of innovation in his field.

Collaborations

Samuel has collaborated with talented coworkers, including Yichen Shen and Shanshan Yu. Their combined expertise contributes to the success of their projects and the advancement of technology at their company.

Conclusion

Samuel Jiang is a key figure in the development of photonic-electronic chip packaging methods. His innovative patent and contributions to the field highlight his role as an influential inventor. His work continues to shape the future of technology in this area.