Sally Y L Foong

Title: Sally Y. L. Foong and Semiconductor Manufacturing Innovations.

Introduction

Sally Y. L. Foong is an inventor associated with Milpitas, California, and Advanced Micro Devices Corporation. Her work includes inventions addressing the safe handling of thin semiconductor wafers and the prevention of substrate warpage during die attachment. Foong is credited with 3 patents.

Latest Patents

One of Foong’s latest patents, “Method and Apparatus for Handling Thin Semiconductor Wafers,” describes cassette designs and processes for handling and thinning delicate wafers. The cassette supports wafers at defined points and accommodates sag or warping, helping automated equipment pick up and move them safely. One design guides wafers through a flattening section so they are held substantially planar. The patent also describes reducing wafer thickness by first grinding the wafer’s back side and then plasma etching it, offering an alternative to more involved grinding and polishing processes.

Another patent, “Mechanical Clamper for Heated Substrates at Die Attach,” describes a clamp that holds a heated substrate flat against a die bonder’s heater block. Spring-loaded rollers press down on the substrate’s outer edges during heating and bonding, helping prevent warpage while allowing the substrate to move into and away from the bonding area.

Career Highlights

Foong’s disclosed inventions focus on practical challenges in semiconductor manufacturing. Her work addresses both the handling of thin, fragile wafers and the stability of heated substrates during die bonding, with designs intended to support reliable processing and automated equipment use.

Collaborations

Foong is associated with Advanced Micro Devices Corporation. Her listed coworkers include Kok Khoon Ho and Lim See-Kee.

Conclusion

Sally Y. L. Foong’s patent work reflects a focus on improving wafer handling, wafer thinning, and substrate stability in semiconductor manufacturing.