This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2006-2008.
Company Filing History:
Years Active: 2006-2008
Title: Saliya Witharana: Innovator in Programmable Package Technology
Introduction
Saliya Witharana is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of programmable package technology, holding 2 patents that showcase his innovative approach to electronic components.
Latest Patents
His latest patents include a method of forming copper layers and a low-cost programmable CPU package/substrate. The first patent describes a programmable package with an embedded fuse, which features first and second terminal ends connected by a central portion that defines a fusible link. The fuse incorporates portions of both the first and second conductive layers, with the first layer being electroless copper and the second layer being electrolytic copper. The design of the fuse can take on a dog-bone or bow tie shape. The method involves providing a substrate with a dielectric layer and forming the fuse by depositing the first conductive layer, followed by the formation and patterning of the second conductive layer over a portion of the first layer. The first layer is then patterned to create interconnects between areas of the second layer.
Career Highlights
Saliya Witharana is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative work. His contributions have been instrumental in advancing the capabilities of programmable packages in the electronics industry.
Collaborations
Some of his coworkers include Hamid Azimi and Debabrata Gupta, who collaborate with him on various projects at Intel Corporation.
Conclusion
Saliya Witharana's work in programmable package technology exemplifies the spirit of innovation in the electronics field. His patents reflect a commitment to enhancing the functionality and efficiency of electronic components.