Saligrama N Subbarao

Title: Saligrama N Subbarao: Innovator in Semiconductor Fabrication

Introduction: Saligrama N Subbarao is a notable inventor based in Plainsboro, NJ (US). He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of via holes in semiconductor wafers. His innovative methods have paved the way for advancements in circuit design and manufacturing.

Latest Patents: Saligrama N Subbarao holds a patent for a "Method for fabricating via holes in a semiconductor wafer." This patent describes a process where a circuit pattern is formed on the front side surface of a semiconductor wafer. An apertured photoresist pattern is then created over the circuit pattern. Via holes are formed by laser irradiating the wafer at sites corresponding to the photoresist apertures. Following this, the back side surface of the wafer is metallized and adhered to a plating block using an adhesive layer. Electrical connections are established between the substrate and the plating block, allowing for electroplating of the via holes. Finally, the substrate is separated from the plating block and adhesive layer.

Career Highlights: Saligrama N Subbarao has had a distinguished career at RCA Inc., where he has been instrumental in developing innovative semiconductor technologies. His work has not only contributed to the company's success but has also had a lasting impact on the industry.

Collaborations: Saligrama has collaborated with various professionals in his field, including his coworker Ho-Chung Huang, who has also made significant contributions to semiconductor technology.

Conclusion: Saligrama N Subbarao's innovative methods in semiconductor fabrication highlight his expertise and dedication to advancing technology. His contributions continue to influence the field and inspire future innovations.